Golay Cell Detector

GC-1P

GC-1T

GC-1D

Material

HDPE

TPX

Diamond

Wavelength

18-8000μm

0.3-6.5μm & 13-8000μm

0.4-8000μm

Application

MIR & THz Radiation

UV-NIR & THz Radiation

VIS & THz Radiation

Diameter of Entrance Cone

11.0mm

Diameter of Entrance Window

6.0mm

Recommended Detector Power

1×10^-5W, THz Attenuators (ATS-5-25.4 & ATS-5-50.8) for Higher Power

Modulation Frequency

15±5Hz

Noise Equivalent Power

Typ. 1.4×10^-10 W√Hz1/2, Min. 0.8×10^-10 W√Hz1/2

Opical Responsivity

Typ. 1×10^5 V/W, Max. 1.5×10^5 V/W

Response Rate

Typ. 30ms, Min. 25ms

Dimension

126×45×87mm

Weight

0.8kg

Specification

Value

Operational frequency range, THz

0,1-15

Free spectral range, THz

0,01-1,8

Spacing between mirrors, mm

0-9,5

Spacing setting accuracy, μm

± 1.25

Optical axis height, mm

110

Free aperture, mm

52

Dimensions (LxHxW), mm

232х151х120

Mass, kg

5,0

Model of the EOD

EOD-NIR

EOD-MIR

EO optical pair crystal – photodiode

ZnTe – Si

CdTe – InGaAs

Signal radiation wavelength, nm

600–1100

1100­­–1700

Signal radiation spectral width(Full width at half maximum /FWHM/), nm

11–20

Spectral sensitivity, THz

0.1–4

Signal radiation impulse duration, fs

<120

Signal-carrying beam power, mW

1–20

Minimal required power of THz radiation, nW

1

Lock-in amplifier modulation frequency, Hz

15–250000

Lock-in amplifier gain

100–30000

Lock-in amplifier time constant, s

0.003–10

Operating temperature, °C

5–45

Storage temperature, °C

0–60

Air humidity, %

5–85

Voltage, V

110 / 220

Frequency, Hz

50

Power consumption, W

18

EOD overall dimensions (L×W×H), mm

268.0×82.0×42.5

Weight, kg

0.8

Part Number Designation
for Tydex Low Pass Filter
LPF <frequency, THz>-<aperture, mm>

Cutting wavelength,
λ_c, µm

Max transmittance
of pass band, %

Damage threshold, W/cm²,CW

LPF23.4-24

13

92

7

LPF23.4-35

LPF23.4-47

LPF23.3-24

13

94

7

LPF23.3-35

LPF23.3-47

LPF23.1-24

13

91

7

LPF23.1-35

LPF23.1-47

LPF14.3-25

21

95

7

LPF14.3-35

LPF14.3-47

LPF10.9-24

27.5

73

8

LPF10.9-35

LPF10.9-47

LPF8.8-24

34

80

8

LPF8.8-35

LPF8.8-47

LPF5.5-24

55

83

8

LPF5.5-35

LPF5.5-47

LPF4.3-24

70

82

8

LPF4.3-35

LPF4.3-47

LPF4.0-24

75

82

8

LPF4.0-35

LPF4.0-47

LPF3.2-24

94

81

8

LPF3.2-35

LPF3.2-47

Substrate material

Hard polyethylene (HDPE)

Spectral range, μm

>= 7

Typical operation aperture, mm

25

Standard holder size at typical aperture, mm

D34.9 x 7.9

Maximal operation aperture, mm

100*

Grooves per mm

1200

Transmission efficiency K1 (average), %

70 - 80

Transmission of unwanted radiation K2 , %

<1 @ 8 μm
<0.1 @ 30-1000 μm

Degree of polarization (K1-K2)/(K1+ K2 ), %

>98 @ 8 μm
>99.5 @ 30-1000 μm

Extinction ratio E=K1/(2 x K2)

35-40 @ 8 μm
350-400 @ 30-1000 μm

Material

HRFZ-Si

Type

plano-plano

Available sizes, mm

to 150

Diameter or cross-cut tolerance,mm

+0.0 /-0.1

Thickness tolerance, mm

+/0.1

Clear apperture, %

>=90

Parallelism, arc. min

3

Surface quality, scr/dig

60/40

Surface accuracy, mm

+/-0.01 deviation from ideal plane

Coating

AR coatings upon request

Material

TPX

Type

plano-convex, bi-convex

Available diameters, mm

to 100

Diameter tolerance, mm

+ /-0.25

Claer aperture, %

>=90

EFL tolerance (for lenses), %

+/- 1

Surface quality (two-sided polishing), scr/dig

80/50

Surface accuracy, mm

+/- 0.01 deviation from ideal sphere and plane

Material

HRFZ-Si

Dimension tolerance, mm

+ /-0.2

Angle tolerance, arc. min

+/-30

Surface quality polished surfaces, scr/dig

80/50

Surface quality of ground surfaces, Ra

2.5

Surface accuracy, mm

+/- 0.01 deviation from ideal plane

THz Achromatic Polarization Converter

THz Achromatic Wave Plate

Retardation

L/4

L/4

Operating wavelength range, um

60-300 or specified by customer

60-95 or specified by customer

Ellipticity tolerance, %

+/- 3 or specified by customer

+/- 10 or specified by customer

Clear apertura, mm

25 (standart) or <25 (upon request)

25 (standart) or <25 (upon request)

Holder

conventional optical component mount or rotator

conventional optical component mount or rotator

Splitter Type

NIR-THz spectral splitter

MIR-THz spectral splitter

Material of substarate

- HRZF-Si
- THz-grade crystal quartz

Dimensions tolerance, mm

+/-0.25

Clear aperture, %

90

Surface quality, scr/dig

60/40

Surface accuracy, mm

+/-0.01 deviation from ideal plane

Coating

High-reflection dielectric coating (R>90%) @ 730-860 nm

High-reflection dielectric coating (R>90%) @ 9-11µm

Angle of incidence, arc. grad.

45

Single-pass THz Beam Splitter

Multi-pass THz Beam Splitter

Material

HRFZ-Si

Type

plano-plano

Available sizes, mm

to 150

Diameter or cross-cut tolerance,mm

+0.0 /-0.1

Thickness tolerance, mm

+/0.1

Clear apperture, %

>=90

Parallelism, arc. min

3

5

Surface quality (two-sided polishing), scr/dig

60/40

Surface accuracy, mm

+/-0.01 deviation from ideal plane

1

Material of substrate

BK7

Type

plano-plano

Dimensions tolerance,mm

+/-025

Clear apperture, %

>=90

Surface quality of polished surfaces, scr/dig

40/20

Surface quality of ground surface, Ra

2.5

Surface accuracy, λ@633nm

1/2

Coating

protected gold

Thickness of gold layer, nm

~400

Parameters

Type of DOE

THz Fresnel lens

THz beam divider

Material

HRFZ-Si

HRFZ-Si

Mechanical diameter, mm

to 55

to 55

Optical diameter, mm

to 50

to 50

Thickness, mm

1

1

Operating wavelength range, µm

60-250

60-250

Diffraction efficiency*, %

40

80

Coating

two-side antireflection

two-side antireflection